Semiconductor End Pump Laser Scribing Machine

  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Hubei

  • Validity to:

    Long-term effective

  • Last update:

    2017-12-08 16:18

  • Browse the number:

    242

Send an inquiries

Company Profile

Perfect Laser (Wuhan) Co., Ltd.

By certification [File Integrity]

Contact:Ms. Nicole Bai(Mr.)  

Email:

Telephone:

Phone:

Area:Hubei

Address:Hubei

Website: http://perfectlaserco.hengyouchina.com/

Product details
Applications
Solar photovoltaic industry, monocrystalline and polycrystalline solar cells (cell) and silicon (wafer) dicing processing (cutting slices)
 
Features
Semiconductor end-pumped; acousto-optic modulator; XY motion table
No need to replace krypton lamps, end-pumped makes more efficient ,forced air cooling no need water cooling.
Better beam quality, lower operating costs, and longer free-maintenance
Machine integration design, with no external connection; easy to install and mobile
Improve the upgrading of products, software upgrade to version 3.0
Long-running stable and reliable

High-end configuration: core components (condenser chamber) imported new materials, greatly improving the electro-optical conversion efficiency of laser using a new generation of gold-plated metal condenser chamber, avoiding off gold, more durable.

Professional Control Software: control software designed according to industry characteristics, friendly interface, easy operation, dicing track display for easy design dicing path change monitoring.

Low operating costs: Operating current is small (less than 11A), fast (up to 140mm / s) to extend the krypton lamp life, reduce maintenance, reduce material consumption and reduce the failure rate and reduce operating costs.

User-friendly design: unique prompts, ensuring the timely replacement of wearing parts

Application scope:
Solar industry silicon, polycrystalline silicon, amorphous silicon dicing with solar cells and silicon (cutting, slicing).

 Technical index
model specification PEDB-50HD 
Laser Power 1064nm
Laser Wavelength 10W/20W/30W/50W
Precision Dicing 30μm
Dicing linewidth 120mm/s
Dicing Precision ± 10μm
Working area 350×350mm
Temperature precision 0.5 ºC
Power Supply 380V(220V)/ 50Hz/3KVA
Working table Vacuum adsorption powerful dedusting
Cooling way Wind Cooling